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Thermal Components
Thermal Interface Materials (TIM): Gap Pads; Sil Pads; Thermal Tapes; Epoxies; Compounds Heatsinks/Extruder: Extruder of Metal; Board Level CPU Coolers; HeatPipes; Cold Plates; Assemblies; Design to Production Insulated Metal PCBs (tClad): Aluminum or Copper substrates; UL approved up to 10 oz copper traces; integrated thermal tape on backside Heaters: Kapton, silicon rubber, Butyl Heaters; Assemblies, wire & Etched Foil Circuits; Thermistors, RTDs & Thermocouples; Military, Medical, Instrumentation
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